As electronic devices continue to shrink while becoming more powerful and complex, printed circuit board (PCB) technology has also evolved to keep pace. Among the essential advancements in multilayer PCB design are blind and buried vias, which play a critical role in enabling high-density interconnections without increasing board size. These special types of vias offer space-saving benefits while maintaining reliable electrical connectivity between layers in compact PCBs. What Are Blind and Buried Vias? In standard multilayer PCBs, vias are tiny holes drilled through the board to connect copper traces across layers. However, as devices become more compact, traditional through-hole vias…
